| 摘要 |
Disclosed is a ceramic electronic component having a structure wherein a metal terminal is bonded to a terminal electrode. In this ceramic electronic component, heat resistance and bonding strength are improved in a bonded portion of the metal terminal where the metal terminal is bonded to the terminal electrode. Specifically, a contact surface of the metal terminal (2), which surface comes into contact with a bonding material (10), is composed of a coating layer (13) which is a plating film of an Ag-base metal. The bonding material (10) contains a metal powder composed of a Cu-base metal and having an average particle diameter of not more than 2.0 mum, and a glass component. When the metal terminal (2) is bonded to a terminal electrode (8) via the bonding material (10), a heat treatment is carried out at 550-750°C while keeping the terminal electrode (8) in close contact with the metal terminal (2) via the bonding material (10), so that an Ag-Cu alloy layer (14) is formed between the metal terminal (2) and a metal bonding layer (10a). The terminal electrode (8) and the metal terminal (2) is therefore bonded by the Ag-Cu alloy. |
