发明名称 |
Method of reducing film stress on overlay mark |
摘要 |
An integrated circuit capable of operating despite a profile shift is disclosed. Overlay marks on the integrated circuit are surrounded by a trench that tends to relieve the effect of a profile shift caused by stress applied to the integrated circuit. The position of the overlay marks tends, therefore, not to be affected by the stress.
|
申请公布号 |
US7323393(B2) |
申请公布日期 |
2008.01.29 |
申请号 |
US20070715527 |
申请日期 |
2007.03.07 |
申请人 |
MACRONIX INTERNATIONAL CO., LTD. |
发明人 |
YEN YU-LIN;CHANG CHING-YU |
分类号 |
H01L21/76;G03F7/20;G03F9/00;H01L23/544 |
主分类号 |
H01L21/76 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|