发明名称 Method of reducing film stress on overlay mark
摘要 An integrated circuit capable of operating despite a profile shift is disclosed. Overlay marks on the integrated circuit are surrounded by a trench that tends to relieve the effect of a profile shift caused by stress applied to the integrated circuit. The position of the overlay marks tends, therefore, not to be affected by the stress.
申请公布号 US7323393(B2) 申请公布日期 2008.01.29
申请号 US20070715527 申请日期 2007.03.07
申请人 MACRONIX INTERNATIONAL CO., LTD. 发明人 YEN YU-LIN;CHANG CHING-YU
分类号 H01L21/76;G03F7/20;G03F9/00;H01L23/544 主分类号 H01L21/76
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