发明名称 Multilayer electronic component and manufacturing method thereof
摘要 A multilayer electronic component is composed of a ceramic body obtained by laminating a plurality of ceramic layers via a conductor layer. The conductor layer is a plated film and extracted to one end face of the ceramic body, thereby contributing to the formation of capacity. A peripheral edge portion of the conductor layer composed of the plated film is thicker than its inner region. This avoids stripping on the peripheral edge portion of the conductor layer and avoids internal defects such as delamination. A dummy conductor layer may be formed at a distance on the end opposite the end face for extraction.
申请公布号 US7324324(B2) 申请公布日期 2008.01.29
申请号 US20050090557 申请日期 2005.03.24
申请人 发明人
分类号 H01G4/005;H01G4/12;B32B3/00;B32B18/00;C23C4/00;C25D1/00;H01G4/012;H01G4/228;H01G4/232;H01G4/30 主分类号 H01G4/005
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