| 摘要 |
A semiconductor apparatus with a modified pipe support. The apparatus comprises an outer pipe, an inner pipe, and a pipe support. The support comprises a seat and a support ring. The seat comprises a tubular portion for supporting an outer pipe at a top end. The support ring is detachably disposed within the tubular portion and comprises am annular surface and an inner bore surface, wherein the annular surface is inclined to the inner bore surface by an acute angle.
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