发明名称 |
STACKED PACKAGE INCLUDING GEL ENCAPSULANT AND FABRICATING METHOD THEREOF |
摘要 |
A stacked package including gel encapsulant and a fabricating method thereof are provided to prevent warpage, tilt, and suck-back phenomenona by applying gel encapsulation. A stacked package including gel encapsulant includes top and bottom packages(1,3), and gel encapsulant(5). The bottom package is electrically connected to the top package. The gel encapsulant disposed between the first and second packages attaches the first and second packages by hardening through the heat treatment. A first stack package is formed by coupling the top and bottom packages and gel encapsulant so that at least one additional package is stacked on the first stack package.
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申请公布号 |
KR20080009463(A) |
申请公布日期 |
2008.01.29 |
申请号 |
KR20060069077 |
申请日期 |
2006.07.24 |
申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
KIM, BONG CHAN;KIM, YOUN SANG;SONG, JAE KYU |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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