发明名称 Method of producing element separation structure
摘要 A method of producing an element separation structure includes the steps of: forming a first thermal oxide film on the substrate; forming a silicon nitride film on the first thermal oxide film; removing the first thermal oxide film and the silicon nitride film in an element separation structure forming region; forming a groove portion in the element separation structure forming region; forming a groove portion oxide film in the groove portion; forming a pre-filling oxide film for filling the groove portion; removing the pre-filling oxide film; forming a resist layer on the silicon nitride film and the pre-filling oxide film; forming a resist mask on the element separation structure forming region; removing the silicon nitride film and the first thermal oxide film; forming a second thermal oxide film on the substrate; and removing the second thermal oxide film and leveling the pre-filling oxide film to form a filling portion.
申请公布号 US7323394(B2) 申请公布日期 2008.01.29
申请号 US20050226412 申请日期 2005.09.15
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 IINUMA TAIKAN
分类号 H01L21/76 主分类号 H01L21/76
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