发明名称 A CAMERA MODULE PACKAGE
摘要 A camera module package is provided to install a lower housing by laminating ceramic sheets where a pattern circuit is formed and connect a substrate, electrically connected to an image sensor, to an external terminal exposed to the outside of the lower housing, thereby making the camera module package slim by reducing the height of the camera module package and improving operation productivity. A camera module package(100) comprises a lens barrel(110), an upper housing(120), a lower housing(130), an image sensor(140), and a substrate(150). The lens barrel has at least one lens(112). The upper housing receives the lens barrel assembled to move in an optical axis direction in the inside. The upper housing is mounted on the upper side of the lower housing. The lower housing has a window(133) through which the optical axis of the lens passes wherein the window is installed in a terminal portion(134) formed in the inside of the lower housing. The image sensor is electrically connected to plural inner terminals(138) installed in the terminal portion of the lower housing to expose an imaging area to the outside through the window. An end of the substrate is electrically connected to plural external terminals(139) exposed to the outside of the lower housing.
申请公布号 KR20080009444(A) 申请公布日期 2008.01.29
申请号 KR20060069027 申请日期 2006.07.24
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, JUNG HOON
分类号 H04N5/225;H01L27/146 主分类号 H04N5/225
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