发明名称 METAL LINE AND METHOD FOR FORMING OF THE SAME
摘要 A metal line and a method for forming the same are provided to prevent overhang by executing uniformly deposition on an insulation layer using TiSiN. A trench where a metal line is implanted is formed on an insulation layer(22). A metal barrier layer(30) of TiSiN is formed on the insulation layer and in the trench. A TiN layer is formed on the trench using a CVD(Chemical Vapor Deposition) technique. By reacting SiH4 gas on the TiN layer, a TiSiN layer is formed. A metal line is implanted into the trench with the metal barrier layer. Planarization is then executed on the metal line.
申请公布号 KR20080009436(A) 申请公布日期 2008.01.29
申请号 KR20060069003 申请日期 2006.07.24
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 JOO, SUNG JOONG
分类号 H01L21/3205;H01L21/28 主分类号 H01L21/3205
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