发明名称 |
Flow through cooling assemblies for conduction-cooled circuit modules |
摘要 |
A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.
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申请公布号 |
US7324336(B2) |
申请公布日期 |
2008.01.29 |
申请号 |
US20050236471 |
申请日期 |
2005.09.27 |
申请人 |
LOCKHEED MARTIN CORPORATION |
发明人 |
VOS DAVID L.;STUTZMAN RANDALL J.;LARCHEVEQUE JON;URDA EUGENE J. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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