发明名称 |
APPARATUS FOR ASSEMBLING SUBSTRATES HAVING CHUCK ALIGNMENT UNIT AND METHOD OF ALIGNMENT CHUCK USING THE SAME |
摘要 |
A substrate assembling apparatus having a surface plate alignment unit and a method of aligning a surface plate using the apparatus are provided to automatically control horizontal alignment of a surface plate on which a substrate is mounted with 6 degrees of freedom and a distance between surface plates to improve the efficiency of surface plate alignment. A substrate assembling apparatus includes a first chamber(20), a second chamber(40) and a surface plate alignment unit(30). The first chamber includes a first surface plate(21) on which a first substrate(S1) is mounted. The second chamber is located apart from the first chamber and includes a second surface plate(41) on which a second substrate(S2) bonded to the first substrate is mounted. The surface plate alignment unit is located between the first chamber and the first surface plate and enables 6 degrees-of-freedom alignment of the first surface plate. |
申请公布号 |
KR20080009542(A) |
申请公布日期 |
2008.01.29 |
申请号 |
KR20060069284 |
申请日期 |
2006.07.24 |
申请人 |
ADP ENGINEERING CO., LTD. |
发明人 |
PARK, SI HYUN;CHO, HYUN WOO;PARK, JANG WAN |
分类号 |
G02F1/13;G02F1/1339 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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