发明名称 APPARATUS FOR ASSEMBLING SUBSTRATES HAVING CHUCK ALIGNMENT UNIT AND METHOD OF ALIGNMENT CHUCK USING THE SAME
摘要 A substrate assembling apparatus having a surface plate alignment unit and a method of aligning a surface plate using the apparatus are provided to automatically control horizontal alignment of a surface plate on which a substrate is mounted with 6 degrees of freedom and a distance between surface plates to improve the efficiency of surface plate alignment. A substrate assembling apparatus includes a first chamber(20), a second chamber(40) and a surface plate alignment unit(30). The first chamber includes a first surface plate(21) on which a first substrate(S1) is mounted. The second chamber is located apart from the first chamber and includes a second surface plate(41) on which a second substrate(S2) bonded to the first substrate is mounted. The surface plate alignment unit is located between the first chamber and the first surface plate and enables 6 degrees-of-freedom alignment of the first surface plate.
申请公布号 KR20080009542(A) 申请公布日期 2008.01.29
申请号 KR20060069284 申请日期 2006.07.24
申请人 ADP ENGINEERING CO., LTD. 发明人 PARK, SI HYUN;CHO, HYUN WOO;PARK, JANG WAN
分类号 G02F1/13;G02F1/1339 主分类号 G02F1/13
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