PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT EMPLOYING THE SAME, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

摘要

A photosensitive resin composition which comprises (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable, ethylenically unsaturated group per molecule, and (C) a photopolymerization initiator, characterized in that the ingredient (A) comprises a polymer comprising units of a compound represented by the following general formula (I): CH2=C(L1)-COOL 2 (I) [wherein L1 represents hydrogen or methyl and L2 represents C2-20 alkyl] and the ingredient (B) comprises a compound represented by the following general formula (II): [wherein R1 represents hydrogen or methyl; R2 represents C3-20 alkyl having two or more, tertiary or higher carbon atoms; X represents C2-6 alkylene; and n is an integer of 1-20].