ELECTROSTATIC CHUCK ASSEMBLY AND METHOD FOR CONTROLLING TEMPERATURE OF ELECTROSTATIC CHUCK

摘要

An electrostatic chuck assembly and a method for controlling temperature of an electrostatic chuck are provided to actively and rapidly control a temperature of a wafer by using a temperature control system having a first temperature control unit and a second temperature control unit. A chuck(102) sucks a wafer(W) with electrostatic chuck. The chuck includes a first channel(150A) where fluid is circulated and a second channel(150B). The second channel provides thermal conductive gas to a rear of the wafer. A temperature control system(160) maintains temperature of the fluid in a first temperature range. The temperature control system changes the fluid maintained in the first temperature range into a second temperature range. The temperature control system includes a first temperature control unit(162) and a second temperature control unit(164). The first temperature control unit maintains the fluid in the first temperature range to provide it to the first channel. The second temperature control unit includes plural temperature control units(166,168) to change the temperature of the fluid into the second temperature range before the fluid maintained in the first temperature range is provided to the first channel.