| 摘要 |
FIELD: metallurgy, coating. ^ SUBSTANCE: invention can be used for receiving of products used in electronics, radio- and electrical engineering, chemical industry, jeweler's art, and also in aerospace engineering. Method includes application on product surface metal salt solution and its further thermal decomposition. In the capacity of metal salt solution it is used solution of compound in organic solvent, at that compound is chosen from group of following compounds: Ni2(H2O)(OOCC(CH3)3)4(HOOCC(CH3)3)4 (1), Ni4(OH)2(OOCC(CH3)3)6(HOC2H5)6 (2), Ni9(OH)6(OOCC(CH3) 3)12(HOOCC(CH3)3)4 (3), Ru3O(OOCC(CH3)3)7(HOOCC(CH3)3)3 (4), or solution of mixture of compounds (1) and (4) in organic solvent, at that molar ratio of metal salt and solvent is from 1:50 till 1:70. Thermal decomposition is implemented by means of heating at a rate of 5-7 degree/min till temperature 400-500°C with further thermostating during 30-90 min. ^ EFFECT: receiving of covering with parameters closed to parameters of solid material. ^ 4 cl, 4 tbl, 4 ex |
