| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board exhibiting high adhesion strength between a seed layer and an insulated base without roughening the surface of the insulated base, by performing preprocessing in gas atmosphere of high degree of vacuum. SOLUTION: The wiring board has an insulated base 10, and a conductive seed layer 20 provided on the insulated base 10. The peeling strength between the insulated base 10 and the seed layer 20 is≥5.0 N/cm, and arithmetic mean roughness of the insulated base touching the seed layer is≤3.1 nm. COPYRIGHT: (C)2008,JPO&INPIT
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