| 摘要 |
PROBLEM TO BE SOLVED: To surely connect respective electrode terminals of respective printed wiring boards by preventing the electrode terminals from being deviated due to the thermal expansion of resin films in a method for arranging solders on respective electrode terminals of the printed wiring boards, arranging respective electrode terminals of the flexible printed boards from the upper part of these electrode terminals, moving down a soldering iron heated at a prescribed temperature from the upper part of the flexible printed wiring boards, and thermocompression bonding respective electrode terminals on the resin films of the flexible printed wiring boards. SOLUTION: A plurality of grooves to be intersected with respective electrode terminals 13 are formed on the depression surface 38 of the soldering iron 3 and the plurality of grooves of the depression surface 38 are intersected with and depressed to respective electrode terminals 13. COPYRIGHT: (C)2008,JPO&INPIT
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