发明名称 DEPOSITION DEVICE, THERMAL BUFFER MEMBER, AND DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a deposition device, a thermal buffer member, and a deposition method that can suppress microcracking in a lower part of a processing container. SOLUTION: The deposition device which performs deposition processing for a plurality of workpieces W comprises the processing container 32 which has a processing tube 34 whose lower part is opened, and includes an opening 38 at a lower end to carry in and out the workpieces; a gas supply means 72 of supplying various gases into the processing container; a workpiece support means 48 carried in the processing container through the opening, while holding the plurality of workpieces in a plurality of stages; a lid 54 which airtightly opens and closes the opening; an elevation means 62 for elevating the workpiece support means and lid in one body to insert the workpiece support means into the processing container and also extract it; an evacuation system 70 which evacuates the container; a heating means 80 provided enclosing the circumference of the processing container; and the opaque thermal buffer member 98 provided between a lower side wall of the processing tube and the heating means. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008016742(A) 申请公布日期 2008.01.24
申请号 JP20060188714 申请日期 2006.07.07
申请人 TOSHIBA CORP;TOKYO ELECTRON LTD 发明人 ENDO ATSUSHI;FUJITA YOSHIYUKI;MIYAZAKI SHINJI
分类号 H01L21/205;C23C16/46 主分类号 H01L21/205
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