| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board excellent in mechanical strength and easily reworked. SOLUTION: The printed circuit board 60 consists of: a BGA package 66; a printed wiring board 61 having the BGA package 66 mounted thereon; and a bonding portion 689. The printed wiring board 61 has a plurality of connection pads 63 provided on positions opposite to solder protrusion electrode 67, and a reinforcing pad provided on opposite positions near a corner portion of a package body 66a. The bonding portion 689 has a metal layer 68 provided on the reinforcing pad 62 via a solder, and an adhesive 69 provided on the metal layer 68 and having its one portion joined at the position near the corner portion of the package body 66a. COPYRIGHT: (C)2008,JPO&INPIT
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