发明名称 |
HEAT DISSIPATION DEVICE WITH HEAT PIPES |
摘要 |
A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.
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申请公布号 |
US2008017351(A1) |
申请公布日期 |
2008.01.24 |
申请号 |
US20060309305 |
申请日期 |
2006.07.24 |
申请人 |
FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
ZHOU SHI-WEN;LIU PENG;CHEN CHUN-CHI |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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