| 摘要 |
<p>A wafer placement cushion sheet (5) having elasticity is placed at a semiconductor wafer placement position on the upper surface of a wafer placement tray (1), and a detachable attachment surface (5B) detachably attached to the wafer placement tray (1) is formed on the wafer placement cushion sheet (5). As a result, a semiconductor wafer is not damaged during transportation, and in addition, the wafer placement cushion sheet (5) can be simply detached from and attached to the wafer placement tray (1) to facilitate cleaning and replacement.</p> |
