| 摘要 |
<p>A method for the production of material plates made of chip- or fiber material, in particular of chipboard, LDF board, MDF board, HDF board, and OSB board, encompasses the following: providing dried chip- or fiber material, plasma-treating the dried chip- or fiber material, applying glue to the plasma treated chip- or fiber material, and compressing the chip- or fiber material that has glue applied into material plates. The invention also relates to such a material plate.</p> |
