| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of securing a heat-resistance reliability, by improving the heat dissipation characteristics and reducing the process cost by reducing the process time, and a manufacturing method of the same. <P>SOLUTION: A printed circuit board includes a first insulating layer 2, a plurality of inter-layer connecting members 6a formed of a conductor in an upper part of the first insulating layer; a second insulating layer 12 laminated on the first insulating layer so as to have the same thickness as that of each connecting member; a third insulating layer 14 laminated on the second insulating layer; circuit patterns 4a and 4b, respectively formed on outside layers of the first insulating and third insulating layers; and a plurality of blind via holes 16, formed on the first insulating layer and the third insulating layer, to electrically connect the circuit pattern and the connecting member. <P>COPYRIGHT: (C)2008,JPO&INPIT |
