| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding mechanism of a wafer which can hold a thinned wafer without damaging, and at the same time, can transfer the wafer even if it is the wafer in which an annular reinforcement is left. SOLUTION: A wafer end 120 moves to right above a wafer 1 while the front edge 122a of a hand pick 122 is directed outward. Further, it descends until the lower surface of the hand pick 122 becomes located below the lower surface of the wafer 1. Then, by the rotation of a hand shaft 124, a gear plate 123 rotates in interlock with this, the hand pick 122 rotates about 180°together with the each pick shaft 125, and the front edge 122a of the hand pick 122 enters into the lower surface of the wafer 1. While holding this status, the wafer hand 120 is raised to lift the wafer 1. COPYRIGHT: (C)2008,JPO&INPIT
|
