| 摘要 |
PROBLEM TO BE SOLVED: To continuously conduct surface treatment of a substrate in the atmosphere, reduce a quantity of scattered wiring metal or its compound during the surface treatment, and save an installation area by omitting a conveyance mechanism for the substrate in a vacuum spare chamber and in a vacuum. SOLUTION: An inert gas is introduced into the inside of the a processing chamber and the pressure is kept at nearly atmospheric pressure, and then a substrate is shipped in the processing chamber and the processing chamber is tightly closed. While the inside of the processing chamber is still kept at the specified processing pressure; the substrate is heated, and a cleaning gas is led into the inside of the processing chamber to remove metallic oxides remaining on the surface of the substrate and to clean the substrate. Then, the cleaned substrate is taken out from the processing chamber. COPYRIGHT: (C)2008,JPO&INPIT
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