| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate-processing apparatus which can reduce the initial and running costs of the apparatus, requires a small installation space, can form a circuit wiring with copper or a copper alloy in a short processing time and prevents a copper film from remaining at an edge/bevel, which causes cross-contamination. SOLUTION: The semiconductor substrate-processing apparatus has a rotary member that rotates around a rotation axis and a plurality of holding members which are arranged along a circle having a center corresponding to the rotation axis of the rotary member and which rotate along with the rotary member, wherein the holding members each has a washing unit for washing a semiconductor substrate held by a rotary holding apparatus that rotates around an axial center of the holding member. COPYRIGHT: (C)2008,JPO&INPIT |
