| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for clipping a semiconductor element capable of improving a product yield. SOLUTION: The method for manufacturing a semiconductor element for acquring a plurality of semiconductor elements comprises a step of cutting a semiconductor wafer W with a plurality of semiconductor elements 2 formed in matrix through a gap part having the predetermined width. The method for manufacturing the semiconductor element further comprises the steps of forming a cutting groove 16 at the gap part by a first cutting edge 14 having a thickness not more than the predetermined width, filling and hardening a resin 20 in the cutting groove, and forming a contour protecting resin layer 4 comprising the resin to the cut cross section of the semiconductor element in the uniform thickness by cutting the resin hardened by the resing filling step along the direction with the cutting groove extended with the use of a second cutting edge 22 thinner than the first cutting edge. COPYRIGHT: (C)2008,JPO&INPIT |
