发明名称 Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem elektrischen Schaltungssubstrat
摘要 <p>The laser beam has a beam spot diameter which is less than the diameter to be drilled, and is moved along a circular path. When aligning the laser beam to a new hole, the beam axis is firstly guided to the mid point of the hole and then in a defined radial movement away from the mid point. The angular direction of the movement is defined based on the jump direction (S) defined by the start position.</p>
申请公布号 DE10251480(B4) 申请公布日期 2008.01.24
申请号 DE2002151480 申请日期 2002.11.05
申请人 HITACHI VIA MECHANICS LTD. 发明人 KILTHAU, ALEXANDER;MAYER, HANS JUERGEN;BIESEN, MARC VAN
分类号 B23K26/38;H05K3/00;H05K3/42 主分类号 B23K26/38
代理机构 代理人
主权项
地址