| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance an accuracy when ultraviolet beams are used as illuminating beams and a surface of a resist pattern is optically inspected. <P>SOLUTION: The method for inspecting a semiconductor device has the steps of: forming a resist pattern 12 in an upper part of a semiconductor substrate 11; applying an acid crosslinking resin 13 on the surface of the resist pattern 12; forming a crosslinking layer 14 adjacent to a boundary between the acid crosslinking resin 13 and the resist pattern 12; removing the acid crosslinking resin 13 with the crosslinking layer 14 being left from the surface of the resist pattern 12; and inspecting the surface of the resist pattern 12 containing the crosslinking layer 14 optically by use of ultraviolet beams 21 serving as the illuminating beams. <P>COPYRIGHT: (C)2008,JPO&INPIT |
