| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a buried pattern substrate and its manufacturing method. <P>SOLUTION: The method for manufacturing the buried pattern substrate is a method for manufacturing a printed circuit board on a surface of which a circuit pattern is formed and between circuit pattern layers of which electrical conduction is established by stud bumping, and includes: a stage (a) for forming the circuit patterns and stud bumps on a seed layer of a carrier film by selectively depositioning a plating layer, where the seed layers are laminated on a surface of the carrier film; a stage (b) for laminating carrier films on an insulation layer so as for the circuit patterns and the stud bumps to face the insulation layer and pressing the carrier films; and a stage (c) for removing the carrier films and the seed layers. Since the method for manufacturing the buried pattern substrate establishes circuit connections between layers with copper (Cu) studs, the method does not need a step of drilling for conduction between layers. Since the method offers circuit design flexibility, does not need Via land, and makes the size of a via small, the circuit density can be increased. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
