| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make a small hole (with a diameter of 50μm or less for example) by carbon dioxide laser, which has been conventionally impossible to be opened. <P>SOLUTION: A method of punching a printed board includes steps of laminating an inner layer copper foil on an inner layer material, laminating an insulation layer on the laminated inner layer copper foil, forming a conformal mask on the laminated insulation layer, and irradiating laser light to the conformal mask to make a hole on the insulation layer. The laser light passes through the insulation layer, and further scatters or sublimates the inner layer copper foil to punch the inner layer material. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
