| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method for forming plating patterns of a plurality of layers without complicating an operation so that each layer has almost the same composition. SOLUTION: Since the total area of a resist pattern 13, the total area of a resist pattern 17 and the total area of a resist pattern 18 are all made equal, the areas of plating regions R13, R17 and R18 in plating each plating pattern A to C can be made always uniform. Thus, plating current density can be uniformly held with ease without changing current value, and the plating patterns A to C having almost equal compositions each other can consequently be extremely efficiently formed. COPYRIGHT: (C)2008,JPO&INPIT
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