| 摘要 |
<P>PROBLEM TO BE SOLVED: To permit deep and homogeneous copper etching by removing minute scum, residues, etc. that are hard to remove on a substrate in a chemical process and reforming the surface, and manufacture a high-grade printed circuit board with few process failures. <P>SOLUTION: A manufacturing method of a printed circuit board comprises: a first plasma treatment stage of coating the surface of a PI or insulating substrate with a highly electrically conductive film containing copper and performing the removal of minute foreign substances and surface reforming of the surface before the step of laminating a DFR on the surface in an SAP process; a second plasma treatment stage of forming a resist pattern after the stage and performing the same treatment as the first plasma treatment to the resist patterns and the surface between the resist patterns; a first etching stage of forming a circuit by applying copper plating between the plasma-treated resist patterns; a third plasma treatment stage of performing the scum removal and surface reforming of the substrate surface and the copper plating after removing the resist pattern on the substrate; and a second etching stage of manufacturing an electric circuit by homogeneously etching the plasma-treated substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
