发明名称 Hybrid Microelectronic Package
摘要 A method and apparatus with a first substrate made of an inorganic material having at least one signal trace and a second substrate made of an organic material having at least one signal trace, at least one interconnect and at least one reception cavity. The first and second substrates are mechanically joined and the at least one signal trace of the first substrate is electrically connected to the at least one signal trace of the second substrate. The first substrate overlays the reception cavity.
申请公布号 US2008017964(A1) 申请公布日期 2008.01.24
申请号 US20060458808 申请日期 2006.07.20
申请人 发明人 SCHOTT DONALD E.;MARTINEZ PETER J.
分类号 H01L23/02 主分类号 H01L23/02
代理机构 代理人
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