METHOD FOR PROCESSING OUTER PERIPHERY OF SUBSTRATE AND APPARATUS THEREOF

摘要

To enhance a removing efficiency of unnecessary matters on a peripheral part of a substrate ( 90 ) such as wafer and to prevent particles from adhering to the substrate ( 90 ). A reactive gas is jetted out from a jet nozzle ( 75 ) toward a target spot (P) of the peripheral part of the substrate ( 90 ) in such a way that the reactive gas is made to flow approximately along a circumferential direction at the target spot (P) of the substrate ( 90 ) as viewed from a direction orthogonal to the substrate ( 90 ). Gases near the target spot (P) are sucked by a suction nozzle ( 76 ) along approximately the circumferential direction at a downstream side of the target spot (P).