AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, METHOD FOR PRODUCING THE SAME, AND CHEMICAL MECHANICAL POLISHING METHOD

摘要

Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains abrasive grains composed of 100 parts by weight of an inorganic particle (A) containing ceria, 5-100 parts by weight of a cationic organic polymer particle (B), and 5-120 parts by weight of an anionic water-soluble compound (C). The aqueous dispersion for chemical mechanical polishing is preferably produced by a method comprising a step for adding a second liquid containing 5-30% by weight of the anionic water-soluble compound (C) into a first liquid containing 0.1-10% by weight of the inorganic particle (A) containing ceria and 5-100 parts by weight of the cationic organic polymer particle (B) per 100 parts by weight of the inorganic particle (A).