| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve close contact strength between a conductor pattern and a substrate thereof without increase of a resistance value of the conductor pattern in manufacturing process of a conductor pattern holding substrate. <P>SOLUTION: A conductor pattern forming apparatus 100 forms a conductor pattern 14 on a target substrate 23 from an inductive thin film material after formation of a conductor pattern precursor 12 on the front surface of an inductive thin film material 4. After an electrostatic latent image 2 is formed on the front surface of the inductive thin film material, this latent image is exposed with an exposure means 3 to generate a pattern. A developing apparatus 7 supplies a conductive particle dispersed solution 6 to this pattern to form a conductor pattern precursor. The conductor pattern precursor is primarily transferred to a conductor pattern holding substrate by feeding the electrical power to the conductor pattern holding substrate 8 where a bonding layer 22 is formed. The transferred conductor pattern precursor is heated using an exposure means 3 to form a conductor pattern. The conductor pattern and bonding layer are peeled from the conductive pattern holding substrate and are then transferred to the target substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
