发明名称 PROCESS FOR MANUFACTURING POWER MODULE
摘要 PROBLEM TO BE SOLVED: To obtain a process for manufacturing a power module in which the reliability of power module can be enhanced by ensuring strong bonding of an insulation sheet and mold resin. SOLUTION: The process for manufacturing a power module comprises a step for mounting an insulation sheet in the cavity of a mold, and mounting an electronic component on the insulation sheet; and a step for sealing the insulation sheet and the electronic component with resin by injecting mold resin into the cavity from the gate of the mold. An air vent is provided as the mold in the vicinity of a region for mounting the insulation sheet. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008016506(A) 申请公布日期 2008.01.24
申请号 JP20060183740 申请日期 2006.07.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 SASAKI FUTOSHI;KANO TAKETOSHI
分类号 H01L21/56;H01L25/07;H01L25/18 主分类号 H01L21/56
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