发明名称 MANUFACTURING METHOD OF HEATSINK OF SEMICONDUCTOR ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal heatsink of a semiconductor element which sufficiently exhibits heat radiation function of a heatsink metal, to further improve the heat radiation performance of the semiconductor element. <P>SOLUTION: The manufacturing method includes: a process for preparing an adhesive tape 102 which has a first surface 104 and a second surface 106, being opposite sides from each other, for bonding the first surface 104 on the surface of a temporary substrate 100; a process for preparing a semiconductor element which comprises a first side and a second side, being opposite to each other, and press-fits the first side to a part of the second surface 106 of the adhesive tape 102, allowing the second side to be exposed; a process for forming a metal thin layer 114 on the second side of the semiconductor element and the exposed portion of the second surface 106 of the adhesive tape 102; a process for forming a metal heatsink on the metal thin layer 114; and a process for removing the adhesive tape 102 and the temporary substrate 100. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008016793(A) 申请公布日期 2008.01.24
申请号 JP20060304340 申请日期 2006.11.09
申请人 NATIONAL CHENG KUNG UNIV 发明人 SU YAN-KUIN;CHEN KUAN-CHUN;LIN CHUN-LIANG;HUANG JIN-QUAN;HU SHU-KAI
分类号 H01L23/36 主分类号 H01L23/36
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