| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device with which air bubbles are prevented from being generated in a solder by an organic impurity, even in the state where the organic impurity is deposited on a pad. SOLUTION: A semiconductor substrate 10 with an electrode pad 20 provided on its surface is heated, and an organic impurity deposited on the electrode pad 20 is volatilized. A solder is subsequently formed on the electrode pad 20. The solder formed on the electrode pad 20 is continuously fused to form a solder bump on the electrode pad 20. COPYRIGHT: (C)2008,JPO&INPIT
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