| 摘要 |
PROBLEM TO BE SOLVED: To provide a frame package type semiconductor laser device capable of acquiring higher output while it is a small package having the same size as that of a conventional one. SOLUTION: The frame package type semiconductor laser device 10 is provided with a semiconductor laser diode chip 14; a main frame 16 having a chip mounting region 16a and a lead portion 16b; a plurality of sub-frames 17, 18 having wire bonding portions 17a, 18a and lead portions 17b, 18b; and a resin forming portion 15. The resin forming portion 15 has a substantially U-shaped resin frame 15b in which its portion facing lead portions of the main frame 16 and the sub-frames 17, 18 is closed and its portion facing the semiconductor laser diode chip 14 is opened and a distance W1 of the opened end side is larger than a distance W2 of the closed end side, and a connection portion 15c provided between the opened and closed end sides of the resin frame 15b is formed into a curved surface. COPYRIGHT: (C)2008,JPO&INPIT
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