| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board for chip-on-film (COF) and its manufacturing method, those of which enhance reliability and productivity of a semiconductor chip mounting line without thermally fusing an insulating layer to a heating tool. SOLUTION: The flexible printed wiring board for COF includes: an insulating layer provided with a release layer formed by a release agent which contains at least one type selected from a release agent including a silazane compound, a siloxane compound, a silane compound, and a silica sol; and a conductor pattern formed by patterning a base film having a conductive layer provided thereon, on the surface opposite to the side for mounting the semiconductor chip. The insulating layer is a hardening body of a polyamide precursor applied on the surface of the conductive layer, coating liquid for forming the release layer is applied on the surface where the conductor pattern of the insulating layer is not formed, and the insulating layer is formed by heating for 1 to 120 minutes at a temperature of 100 to 200°C or by drying and hardening after applying resin solution for the polyamide precursor to the conductive layer. This can mount the semiconductor chip from the back side of the insulating layer while preventing the edge of a bonding tool from being contaminated. COPYRIGHT: (C)2008,JPO&INPIT
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