发明名称 INTEGRATED CIRCUIT HAVING SECOND EPITAXIAL LAYER
摘要 An integrated circuit having a semiconductor device with reduced "tail" resistance and production method for such a device is disclosed. One embodiment provides at least one substrate of a first conduction type doped with a first concentration of donors of a first atom type, and a first epitaxial layer of the first conduction type doped with a second concentration of first donor atoms. A second epitaxial layer of the first conduction type doped with a third concentration of donors of a second atom type is formed between the first epitaxial layer and the substrate.
申请公布号 US2008017898(A1) 申请公布日期 2008.01.24
申请号 US20070780253 申请日期 2007.07.19
申请人 INFINEON TECHNOLOGIES AUSTRIA AG 发明人 HAEBERLEN OLIVER
分类号 H01L29/78 主分类号 H01L29/78
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