| 摘要 |
PROBLEM TO BE SOLVED: To provide a prober controller which can reduce measurement error by suppressing a change in temperature on the surface of a wafer chuck, before and after a wafer is fixed during heating and cooling by a high/low temperature wafer chuck. SOLUTION: The prober controller includes a wafer chuck 16 for fixing a wafer, a movable stage that can move the wafer chuck 16 in three-dimensional direction, a temperature adjusting device 5 that is incorporated in the wafer chuck 16, and a wafer suction groove 6 formed on a wafer placement surface for the wafer chuck 16. It controls a negative pressure flow rate to the wafer suction groove 6. When a wafer is placed on the wafer chuck 16, a reference negative pressure flow rate is supplied to the wafer suction groove 6, and the wafer is not placed on the wafer chuck 16. When a temperature adjusting device 5 is in operation, a negative pressure controller 50 is provided to supply a negative pressure flow rate of less than the reference negative pressure flow rate to the wafer suction groove 6. COPYRIGHT: (C)2008,JPO&INPIT
|
