| 摘要 |
PROBLEM TO BE SOLVED: To form a film having a uniform thickness while reducing the frequency of cleaning inside of an apparatus using an etching gas etc. SOLUTION: A deposition film forming apparatus 1 is provided with a film forming chamber 20 for housing an object 3 of deposition film formation; a material gas supply means 5 for supplying a material gas to the film forming chamber 20: and one or more heat generators 6 for using the material gas as deposition seed. In this apparatus 1, the heat generator 6 is provided with an internal space 61 for allowing the material gas supplied by the material gas supply means 5 to pass therethrough and decomposing at least one part of the passing material gas to make the gas into the deposition seed; and one or more discharge ports 62 for discharging the deposition seed in the internal space 61 toward the object 3 of deposition film formation. COPYRIGHT: (C)2008,JPO&INPIT
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