| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for tightly and uniformly sticking semiconductor chips having many bumps on their surfaces to a protection tape. SOLUTION: The protection tape 2 is adsorbed to an adsorption plate 3 composed of porous ceramic to adsorb and correct the protection tape 2 on a plane, divided semiconductor chips 1 are aligned and arranged on the adhesive surface of the protection tape 2, and then the semiconductor chips 1 are uniformly pressed by a pressure plate 10 using Teflon to uniformly depress bumps of the semiconductor chips 1 into the adhesive layer of the protection tape 2. The pressure plate 10 is depressed by a pressure means composed of an elastic body (elastic sheet) 9 having inner pressure. COPYRIGHT: (C)2008,JPO&INPIT |
