| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, which is capable of restraining burrs from occurring when an integrated circuit chip, to which a support member is bonded for support, is divided into chips. SOLUTION: The support member 13, which includes a thin film 14 whose member becomes small in thickness (or, an air gap 14 that has no thickness and is substantially a through-hole), is bonded through an adhesive agent 12 to the rear surface of a semiconductor substrate 10, where an integrated circuit 11 has been formed on its main surface, in a region corresponding to scribe lines formed on the integrated circuit 11, then a dicing tape 15 is pasted on the support member 13 to keep the whole in a fixed state, the integrated circuit 11, the semiconductor substrate 10, the adhesive agent 12, and the support member 13 are cut off, and then the dicing tape 15 is separated off. COPYRIGHT: (C)2008,JPO&INPIT |
