| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for semiconductor element and a multi-chip module, capable of suppressing the changes in the characteristics of the semiconductor element when the semiconductor elements are mounted on a substrate at high density. SOLUTION: A heat insulator 9 is provided that can hinder the thermal conduction between a plurality of regions for mounting the semiconductor element, such as an image sensor 6, an element 8 for driving, or the like. COPYRIGHT: (C)2008,JPO&INPIT |
