| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating bath for aluminum and an electroless plating method for aluminum where the consumption of electric power is remarkably reduced, aluminum plating can be performed not only to a substrate of metal such as copper, brass, nickel and iron having electrical conductivity but also to a substrate of an insulator such as glass, plastics and ceramics, and further, aluminum plating can be performed even to a material with a complicated shape. SOLUTION: Using an electroless aluminum plating bath comprising an aluminum-containing room temperature molten salt and a reducing agent for plating aluminum, and, using the one obtained by being dipped into a palladium chloride-containing solution and being subjected to activation treatment as the body to be plated, aluminum is electroless-plated to the body to be plated in a dry inert gas atmosphere, thus the problem is solved. COPYRIGHT: (C)2008,JPO&INPIT
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