| 摘要 |
A semiconductor device having a fuse and a method for cutting the fuse of the semiconductor device are provided to reduce the manufacturing time of the semiconductor device by reducing laser radiation time required for the cutting of the fuse. A semiconductor device having a fuse is prepared. The fuse includes a first line pattern, an insulation film(120), and a second line pattern. The first line pattern used as low fuses(130') is formed on a substrate(100). The insulation film is formed on the substrate having the first line pattern. The second line pattern used as upper fuses(160') is formed on the insulation film. By radiating laser beams on the upper fuses, the upper and lower fuses are sequentially cut off.
|
