REWORKABLE LIQUID EPOXY RESIN COMPOSITION FOR UNDERFILLING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

A liquid epoxy resin composition for underfilling a semiconductor device, and a semiconductor device packaged by using the composition are provided to improve interlayer filling property, the resistance against thermal and mechanical stress, fluidity and reworkability. A liquid epoxy resin composition comprises 15-60 wt% of an epoxy resin which comprises a bisphenol-based epoxy resin represented by the formula 1 and a plastic epoxy resin represented by the formula 2 or 3; 10-30 wt% of a curing agent; 0.5-10 wt% of a curing accelerator; and 25-65 wt% of an inorganic filler, wherein R are independently H or a C1-C6 alkyl group and n has an average of 1-3. Preferably the curing accelerator comprises an imidazole-based catalyst.