| 摘要 |
PROBLEM TO BE SOLVED: To actualize micronization in a substrate and a semiconductor chip, etc. SOLUTION: A metal and alloy material/semiconductor material/insulating material (resin), etc. are implanted/impregnated in a honeycomb porous ceramics material, to form a ceramics composite laminated material of several layers. COPYRIGHT: (C)2008,JPO&INPIT
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